EBYTE E30-170T20D

Pukapuka Tohutohu mō te Momo Ahokore EBYTE E30-170T20D

Tauira: E30-170T20D

1. Kupu Whakataki

The EBYTE E30-170T20D is a high-performance wireless module based on the SI4463 chip from Silicon Labs. It operates in the 148~173.5MHz frequency band and offers transparent data transmission with TTL level output. This module is designed for applications requiring long-distance communication, robust performance, and low power consumption, featuring an air wake-up function (WOR) and Forward Error Correction (FEC) algorithm.

Its 170MHz frequency provides excellent penetration and diffraction capabilities, making it suitable for industrial and indoor environments. The module supports both SMD and DIP interfaces for flexible integration.

Āhuatanga matua:

Taupānga Angamaheni:

2. Tatūnga

2.1 Kōwae Nekeview

The E30-170T20D module features a compact design with a metal shield covering the main IC. It includes a standard SMA connector for antenna attachment and a row of pins for power and data communication.

EBYTE E30-170T20D Wireless Module

Whakaahua 2.1: Runga view of the EBYTE E30-170T20D wireless module, showing the EBYTE logo, model number, RoHS and CE marks, and the SMA antenna connector.

2.2 Te Pinout me ngā Hononga

The module provides a set of pins for power supply and UART communication. Ensure correct voltage and data line connections to avoid damage.

EBYTE E30-170T20D Module Pinout

Whakaahua 2.2: Raro view of the EBYTE E30-170T20D module, displaying the pin labels (M0, M1, RXD, TXD, AUX, VCC, GND) and an ESD sensitive device warning.

The pins typically include:

2.3 Hononga Antenna

The module features an SMA interface for connecting an external antenna. Ensure the antenna is securely attached to maximize transmission distance and signal integrity.

EBYTE E30-170T20D Module with Antenna

Figure 2.3: The EBYTE E30-170T20D module with an antenna connected to its SMA port, illustrating the compact form factor.

2.4 Nga whakaaro mo te whakaurunga

For secure mounting, the module may include nuts and washers for the SMA connector. These components help in firmly attaching the module to an enclosure or panel.

EBYTE UART DIP Module Installation Components

Figure 2.4: Illustration of the nuts and washers provided for the EBYTE UART DIP module, designed for secure installation.

3. Nga Tohutohu Whakahaere

3.1 Whakawhiti Puata

The E30-170T20D module supports transparent transmission, meaning data sent to its UART input (RXD) will be wirelessly transmitted, and data received wirelessly will be output through its UART output (TXD). This simplifies integration as no complex protocol handling is required at the host microcontroller level for basic data transfer.

3.2 Air Wake-up Function (WOR)

The module features a WOR function, enabling ultra-low power consumption. In WOR mode, the module can periodically wake up to check for incoming data, and if no data is detected, it returns to a low-power sleep state. This is ideal for battery-powered applications where energy efficiency is critical.

3.3 Forward Error Correction (FEC)

The integrated FEC algorithm enhances the reliability and transmission range of the module. FEC proactively corrects interfered data packets, reducing data loss in environments with sudden interference. Without FEC, such packets would typically be dropped, leading to reduced data integrity and effective range.

3.4 Data Rate and Half-Duplex Operation

The module supports air data rates ranging from 1kbps to 25kbps. It operates in half-duplex mode, meaning it can either transmit or receive data at any given time, but not simultaneously. Proper communication protocols should account for this half-duplex nature to manage data flow effectively.

4. Tiaki

4.1 Tiakitanga Whanui

4.2 Whakatupatotanga Whakatupatotanga Whakarere Hiko (ESD).

The E30-170T20D is an ESD sensitive device. Always handle the module with appropriate ESD precautions, such as using an anti-static wrist strap and working on an ESD-safe mat, to prevent damage to internal components.

4.3 Taiao Whakahaere

The module is designed for industrial-grade applications and can operate reliably in temperatures ranging from -40 °C to 85 °C. While robust, prolonged exposure to the extreme ends of this range or rapid temperature changes should be minimized to ensure longevity.

5. Te Raru

5.1 No Communication

5.2 Poor Range or Signal Quality

5.3 Kāore te Kōwae e Whakautu

6. Whakatakotoranga

TawhāUara
ICSI4463
Awhe Auautanga148~173.5MHz
Tuku Mana10~20dBm (100mW max)
Tawhiti WhakawhitiwhitiTae atu ki te 2.0 kiromita (raina tirohanga)
AtangaUART (TTL level)
Tuku Hiko2.3V~5.2V DC
Te Waahi Mahi-40 °C ki te 85 °C
Reiti Raraunga1bps ~ 25kbps
Kaihono TanihiniSMA
AhuRefer to datasheet for exact dimensions (DIP/SMD)
TautukungaFCC, CE, CCC

7. Pūtāhui me te Tautoko

7.1 Nga korero a te Kaihanga Kaihanga

The E30-170T20D module is manufactured by EBYTE. For detailed technical support, datasheets, and further product information, please visit the official EBYTE webpae:

http://www.cdebyte.com/

7.2 Tautukunga

The E30-170T20D strictly adheres to design standards of FCC, CE, and CCC, meeting various RF certification requirements for export. Users are advised to ensure their application of the module complies with local regulations regarding radio frequency devices.